STArPAC will be one of the best boutique assembly and packaging service provider targeting to provide low-volume, high-mix and high performance services and packaging products.

To save time and maximize return-on-investments, STArPAC will provide total assembly and packaging services and products to its customers.  STArPAC is aimed to become one of the best boutique assembly and packaging house specializing in high temperature, ESD free, low pressure, etc. applications.  Coupled with low-volume and high product mixed capability, STArPAC will position itself to best serve customers requiring high performance, short lead time, fast delivery, and good quality services and solutions.

WHO WE ARE

STArPAC is incorporated with the concept of putting the best in reliability packaging and testing under one roof to serve the customers.  STArPAC is a joint venture located in Singapore that is formed by STAr Technologies and Semi-Pac. 

STAr Technologies has accumulated years of measurement expertise and has since become one of the leading solution provider for advanced electrical tests systems for parametric and reliability tests. 
Semi-Pac was founded in 1988 to provide cost effective semiconductor packaging solutions to the electronic industry.  Semi-Pac has over 20 years of experience focusing on advanced package and process development with extensive coverage for all types of packages, side-braze, chip carriers, multi-chip modules, and hybrids.

What We Do

STArPAC is a boutique assembly and packaging service and solution provider enabling low volume and high mix services and products to customers.  These high performance services include:

• Assembly process for advanced semiconductor ICs utilizing ultra low-k processes,
• Assembly of ICs with extremely small pad size and tight pitch for both pads and modules,
• Assembly and packaging process for ICs used under extreme temperature conditions,
• Assembly and packaging process for ICs without ESD protection circuitry,
• Job shop assembly and packaging processes for low volume high mix IC under short lead time and low cost.