Block 20, Woodlands Link, #07-03,
Woodlands East Industrial Estate
Singapore 738733
ph: +65 6853-9477
fax: +65 6853-9727
contact
STArPAC is incorporated with the vision of putting the best in assemblies, packaging and testing under one roof to serve our partners and customers. In July 2008, Semi-Pac and STAr Technologies put together a proposal to form this joint venture - STArPAC.
Semi-Pac was founded in 1988 to provide cost effective semiconductor packaging solutions to the electronic industry. Semi-Pac has over 20 years of experience focusing on advanced package and process development with extensive coverage for all types of packages, side-braze, chip carriers, multi-chip modules, and hybrids. STAr Technologies has accumulated years of measurement expertise and has since become one of the leading solution provider for advanced electrical tests systems for parametric and reliability tests. STAr Technologies’ products solve emerging measurement needs in the semiconductor device research and development, reliability assurance, wafer acceptance test, and failure analysis.
STArPAC has the target of becoming the leading boutique packaging and assembly company focusing on nanometer technology applications such as ultra-fine scribe-line wafer dicing, low-pressure bonding, high temperature packaging, ESD free packaging for integrated circuits with minimal or no ESD protection circuitries, etc. These advanced packaging and assembly processes are currently in the forefront of research especially looking forward into the future needs of deploying active integrated circuits to improve energy efficiencies for applications such as hybrid cars, active power controls for lightings, etc.
STArPAC initial setup will involved transfers of intellectual properties from Semi-PAC and STAr Technologies. This will enable STArPAC to provide our customers with excellent services of proven quality within the shortest possible period.
STArPAC will setup an research and development center in Singapore in anticipation to serve our customers who requires advanced next generation assembly and packaging requirements. The research program will conincides with our continous service improvement programs with our customers or partners in Singapore.
©2010 STArPAC Technologies
All rights reserved.
Block 20, Woodlands Link, #07-03,
Woodlands East Industrial Estate
Singapore 738733
ph: +65 6853-9477
fax: +65 6853-9727
contact