Within a wafer fab, the QRA (quality and reliability assurance) department will be responsible for qualifying all new processes in development as well as providing reliability performance information on the existing processes and ICs that are being manufactured in the production line. These processes require substantial numbers packaged MOSFETs, dielectrics (gate oxides and inter/intra-metal dielectrics) and interconnects to be tested for a prolonged period under high electrical stress and extreme temperature conditions.  In addition, these components are normally designed and fabricated without ESD protection circuits as the change in its inherent electrical characteristics will have to be monitored with high accuracy. 

STArPAC provides low-pressure, high temperature and ESD-free assembly and packaging solutions for customers in this areas of needs.  STArPAC can also provides post-packaging electrical tests to ensure that the packaged parts are good for reliability tests.

The ESD qualification methods for ICs have traditionally of requiring performance to human-body model (HBM) levels of 2KV, and in some cases 200V for machine model (MM).  In recent years, CDM has come into focus, but specific requirements are unclear, other than 500V as a good benchmark value.  With advanced packaging, assembly and RoHS requirements, ESD qualification has extended into many unchartered areas with higher pulse voltages and currents, shorter pulse time and more pulses.

STArPAC provides assembly and packaging services for ICs and packages provided by customers.  Our service will ensure that the device under service will be free from assembly and packaging defects and can sustain high voltages and currents tests required under ESD and latchup characterization. 

New types of packaging for advanced package-level burn-in (PLBI) are required to address the growing industry demand for product shipped as known good die (KGD).  Cost analysis showed that commercial PLBI technology is dominated by assembly and packaging of the dies required for burn-in.  Extreme high power devices dissipating high heat are also in high demand for advanced assembly and packages capable of thermal control and management during burn-in.

STArPAC provides assembly and packaging solutions for burn-in tests that may require the DUTs to be under high temperature controlled environment.  Fast turnaround time of good parts ensures customers with the fastest time-to-market requirements.

Active power ICs are of high demands in view of improved power management capabilities for reduced power consumption in comparison with passive components.   This demand is further amplified by the recent escalating oil prices.  Automotive ICs and components such as IGBTs are also in increasing demand as more automobiles have increasing electronic ICs and with special focus on hybrid vehicle power trains .  New assembly and packaging needs for medical devices, MEMS, HBLEDs, etc. such as high current, high temperature, high emissitivity, etc.

STArPAC partners with our customers to provide customized assembly and packaging processes to ensure that the final products meet the stringent requirements with good yield especially during product prototyping.